Hi,
The Ultra96-V2 comes with an active fan heat sink. Can I remove the fan and use the chassis of a box for heatsinking?
You’d have to look at the various Xilinx documentation on thermal design. A good starting point is here:
Note this key quote in particular:
Unlike features in an ASIC or a microprocessor, the combination of FPGA features used in a user application is not known to the component supplier. Therefore, it remains a challenge for Xilinx to predict the power requirements of a given FPGA when it leaves the factory. Accurate estimates are obtained when the board design takes shape.
In other words the thermal behavior of the board will be strongly dependent on the design you load onto it! You should probably use the active heatsink as you develop your design and then characterize its power requirements and develop the thermal design accordingly.
