Is POP designed aka RAM on top of SOC requested by 96 boards ?
As we can't use Kirin 960 on max frequency as it can't pass heat over RAM module
It is impossible to cool Kirin 960 on 2,4GHz on big cores.
I remember raspberry pi 1 that also use POP design with RAM on top and next versions use RAM module on other side of board. It is nice solution for mobile phones but I think it is useless for boards like this, except it lower cost.