I’m going to redesigning a mezzanine for a client soon and want to take the opportunity to improve the rather pool cooling solution we had in place. We are using the Hikey960 and it runs really hot. Using a tiny flat ceramic heatsink and a tiny 17mm * 3mm fan sandwiched between the mezzanine and the Hikey960 that sucks air through a hole in the mezzanine, along with a few additional of those tiny fans in the casing, we managed to stabilize the temperature around 80 degrees Celsius, but this meant throttling down the HiKey to ±900 Mhz.
We had another iteration that involved running a heatpipe between the mezzanine and the HiKey which performed slightly better, but this tunred out to be an engineering nightmare with regards to the enclosure.
For the next version, I’m planning to fixate a milled block of copper or aluminum between the SoC and the mezzanine, to guide heat to the mezzanine PCB, which then itself act as a heatsink, optionally with additional heatsinks on top of that.
I’m wondering if anybody here might have experience with this approach, or possibly an alternative simple solution.
Our application is a Unity application that uses a lot of GPU time, hence the heat.